Cutting-edge Semiconductor Manufacturing Equipment
for Next-generation Information Technology

Komatsu NTC develops high-production Processing Machines using our accumulated mechatronic technology and know-how for Machine Tools. Our skills in processing have been applied to semiconductor materials, crystal materials, and new materials. Komatsu NTC has contributed greatly
to the production of semiconductor devices such as minutely accurate Double Disc Grinding Machines for wafer grinding.

MWM Series

The Multiwire Saw MWM Series was developed by Komatsu NTC to slice wafers. It slices a silicon ingot into several hundred wafers simultaneously by applying a mixture of fine grains dispersed in liquid called slurry to wires rotating at high speed. Komatsu NTC boasts the world´s number 1 market share.

MPG/MPE Series

The Micro-precision Double Disc Grinding Machine MPG Series simultaneously grinds both sides of a wafer sliced using the MWM Series, and is joined by the Edge Grinding Machine MPE Series, which not only provides better quality wafers, but also greatly improves productivity.